Opportunities
Micron Semiconductor Combine
The Micron Semiconductor Combine provides university students with a unique opportunity to learn more about Micron, its products, history, and future. Students will tour Micron and will be able to ask questions about employment and internship opportunities.
University students are encouraged to upload their resume and bring it with them to the event. They will have time to discuss career opportunities with Micron hiring managers and recruitment professionals.
There is no cost to attend, however students must be registered. Registration closes November 12 and is limited to 100 students.
Registration can be found on Micron's website
Microelectronics Commons Program
UNICOS Joins three Hubs established under the CHIPS and Science Act
The Board of Trustees of the Leland Stanford Junior University, California-Pacific-Northwest AI Hardware Hub (Northwest-AI-Hub)
The Northwest-AI-Hub is led by Professor H.-S. Philip Wong, who is based at Stanford University’s School of Engineering and is a Professor of Electrical Engineering. The Northwest-AI-Hub supports the following technology areas:
- Artificial Intelligence/Hardware
The Northwest-AI-Hub is an innovative ecosystem and infrastructure comprising physical and virtual facilities. Its primary objective is to facilitate the lab-to-fab translation of AI hardware technologies, catering to regional and national needs.
Midwest Microelectronics Consortium Hub, MMEC
The MMEC Hub is led by the Hub’s CEO, Jackie Janning-Lask. The Hub is based out of Dayton, Ohio. MMEC supports the following technology areas:
- Commercial Leap-Ahead Technologies
- Electromagnetic Warfare
- Quantum Technology
MMEC is a non-profit consortium uniting industry, academia and government to advance microelectronics tech in the U.S. Its collaborative ecosystem fosters innovation from lab-to-fab, empowers members to share knowledge, helps to develop the next-gen workforce and brings world-class innovation to scalable commercial production.
AZ Board of Regents on Behalf of Arizona State University, Southwest Advanced Prototyping Hub (SWAP)
The SWAP Hub is in Phoenix, Arizona, and is led by Grace O’Sullivan, the Vice President of Corporate Engagement and Strategic Partnerships at Arizona State University’s Knowledge Enterprise. The SWAP Hub supports the following technology areas:
- Artificial Intelligence/Hardware
- 5G/6G Technology
- Commercial Leap-Ahead Technologies
The Arizona State University-led Southwest Advanced Prototyping (SWAP) Hub unites over 70 semiconductor and defense companies, academic institutions, and national laboratories from across the nation. The hub delivers flexible, low-cost microelectronics prototyping capabilities tailored to Department of Defense needs.
Funding Opportunities for Engineering Research in Microelectronics and Semiconductors
Deadline: April 30, 2024
NSF and the Engineering Directorate invest in research and education activities in the area of semiconductors that align with the needs of the nation and support the CHIPS and Science Act of 2022, White House strategies, and other policy directives (such as the 2022 report from the President’s Council of Advisors on Science and Technology, Revitalizing the U.S. Semiconductor Ecosystem) to enable U.S. leadership, spur economic growth, and advance jobs in microelectronics and semiconductors.
SWAP Hub
Dear SWAP Hub Members,
The Microelectronics Commons Call for Topics is now open. The Technical Guidance and other relevant documents are attached. Please use these documents to develop topics that are relevant and of interest to your organizations and proceed with teaming. Within the next few days, we will provide information on how to submit your responses to the SWAP Hub.
Please note that the submission deadline set by the sponsor is July 24. We are requesting that you submit your responses to the SWAP Hub by July 15 so that we can review and rank/prioritize the responses. We will submit to the sponsor all responses received by July 15. Responses must be 3-5 pages in length and transition partners (Programs of Record, Commercial Transition Partners, DIB’s, etc.) must be identified. There is also the option of indicating multiple Hubs in the response.
Please feel free to reach out to me with questions about SWAP Hub capabilities and teaming. The SWAP Hub website includes useful information.
Please note the following additional guidance from the sponsor:
Responses must address the following:
- Identify Teaming Partners (Lab-to-Fab) - Start-Ups, DIB Partners, COREs, etc.
- Identify Transition Partners - Programs of Record, Commercial Transition Partners, DIB’s, etc.
- Any Attachments supporting the CFT response to include graphs and other pertinent information (Does not count towards page count).
- Describe how Existing Hub Capabilities will accelerate Lab-to-Fab.
- What Technical Area and how it ties to updated Technical Guidance.
- Current State of the Technology and Desired End-State (Where is this topic going?).
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- Is there a demonstrated prototype within the lab? If so, what’s the current TRL/MRL?
- Has this topic benefited from any previous investments (USG or IRAD)?
- Does it add a new capability to the DIB or DoD at the system level?
- Is there a proposed (or identified) transition opportunity or a commitment from a program of record or a DoD prime?
- How does the proposed topic ensure long-term access (e.g. PDKs, IP, infrastructure, on-shoring of technology)?
- Draft Success Criteria for a Topic (Metrics).
- Fill out the Call for Topics (CFT) Summary Form (Attachment A) and include the full 3-5 page topic response within the same PDF as a cover sheet for the submitted topic. (Does not count towards page count).
- Fill out Call for Topics Summary Quad Chart (Does not count towards page count) (Attachment B).
- Fill out the Heilmeier Response (Does not count towards page count) (Attachment C).
Sincerely,
Krishnendu Chakrabarty
Chief Technology Officer, SWAP Hub
Call For Projects Update
Thanks to you, we had over 75 submissions to our SWAP Hub Limited Submission Process for the 15-project limit! As you can imagine, that was a tremendous response with an equally overwhelming amount of work to narrow down the projects to the 15 we can submit. Thanks to everyone for taking the time to propose your prototyping ideas to the SWAP Hub. For those of you who did not get selected to advance to full proposal, here are some other avenues to engage to determine if we can help your project move forward prior to next year’s Call for Projects:
- Upcoming NSTXL Call for Topics (expected in spring) to determine next year’s Call for Projects
- Other CHIPS Act programs (eg. NAPMP expected by April)
- Small Business Innovation Research (SBIR) and Small Business Technology Transfer (STTR) programs
- ASU co-invests, with companies, in collaborative research projects through the Impact Arizona Science and Technology Centers (STCs). All six of the STCs develop or use microelectronics. To meet potential faculty research partners and learn about the upcoming funding opportunity announcement, join us on February 28th for the next ASU Industry Technology Innovation Summit.
- You can use new semiconductor processing, metrology, and test equipment—funded by the SWAP Hub and other recent investments—through ASU’s Core Facilities. The Core Facilities enable researchers to use equipment themselves after training or to have a professional staff member operate equipment on their behalf, both on a pay-per-use basis. Available equipment ranges from 300 mm direct-write lithography to power device analyzers to aberration-corrected transmission electron microscopes.
- Engaging with SWAP Hub universities and community colleges (over 50,000 engineering students) on internships and capstone projects
- For more information on these and other opportunities at ASU, please contact Katie Smith (SwapHub@exchange.asu.edu).
Membership Update
SWAP Hub is now over 130 members strong! Since December we have added over 60 new members. We are updating our website to display new members and will be working on a new website over the next several months to better reflect the needs of the Hub and our partners. Here is our breakout of membership by company type/size as of a couple weeks ago:
NSTXL/DoD Roadshow Visit
On January 26th, we hosted over 30 DoD and NSTXL (National Security Technology Accelerator – our award sponsor) personnel as they traveled around to all 8 Hubs. It was an excellent visit where we covered our strategy, highlighted some of our partners, and made many connections with our sponsor. We received great feedback and look forward to incorporating it into our Hub activity. Key focus items from the DoD and NSTXL were to focus projects on delivering prototypes quickly and for the Hub leadership to focus on sustainability after federal funding is reduced/eliminated to ensure the benefits of the Hubs and Microelectronics Commons live on.
We are excited for what lies ahead! Please feel free to reach out to us if you have any questions or thoughts. This address works best to reach us: swaphub@exchange.asu.edu.